The new generation of ceramic surface grinder adopts ultrasonic vibration dressing method, which can quickly achieve the ideal mirror effect of the workpiece. It is mainly composed of ultrasonic generator and transducer. When dressing, the ultrasonic vibration dressing device will be adjusted to the vibration state. When dressing the abrasive particles, it will pass between the grinding wheel and the trimmed elements, The dressing elements can be used to transfer energy, which can effectively remove the geometric grade of the grinding wheel surface, so that the abrasive particles will protrude from the surface of the grinding wheel.
The new generation of ceramic plane grinder is a precision grinding and polishing equipment. The materials to be ground and polished are placed on a flat grinding plate. The grinding plate rotates counter clock, the correction wheel drives the workpiece to rotate, and the workpiece is pressed by gravity or other methods. The workpiece and the grinding plate make relative running friction to achieve the purpose of grinding and polishing. Because this method mainly adopts vibration, The dressing abrasive grain itself will have a certain energy, so it can get a relatively good dressing effect. It is widely used for single-sided grinding and polishing of LED sapphire substrate, optical glass wafer, quartz wafer, silicon wafer, chips, molds, light guide plates, light cutting joints and other materials.